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ADSP-BF606KBCZ-4

기술:
ADSP-BF606KBCZ-4 datasheet pdf and Embedded - DSP (Digital Signal Processors) product details from Linear Technology (Analog Devices, Inc.) stock available at Rozee
범주:
융합 회로 (IC)
상술
Part Number:
ADSP-BF606KBCZ-4
Manufacturer:
Linear Technology (Analog Devices, Inc.)
Description:
In stock. Alternative models available.
Lifecycle:
New from this manufacturer
Delivery:
DHL、UPS、FedEx、Registered Mail
Payment:
T/T Paypal Visa Western Union
More Information:
ADSP-BF606KBCZ-4 More Information
ECAD:
Request Free CAD Models
Pricing(USD):
$25.48
Remark:
Manufacturer: Linear Technology (Analog Devices, Inc.). Rozee is one of the Distributors. Wide range of applications.
Mount:
Surface Mount
RAM Size:
128 kB
Interface:
2-Wire, CAN, Ethernet, I2C, SPI, UART, USB
Memory Size:
32 kB
Case/Package:
BGA
Data Bus Width:
24 b
Number of Pins:
349
Core Architecture:
Blackfin
Min Supply Voltage:
1.25 V
Number of SPI Channels:
2
Number of UART Channels:
2
Operating Supply Voltage:
3.3 V
Min Operating Temperature:
0 °C
Number of Ethernet Channels:
2
Products Category:
Integrated Circuits (ICs) - Embedded - DSP (Digital Signal Processors)
Qty:
4763 In Stock
Applications:
Connected peripherals & printers Hybrid, electric & powertrain systems PC & notebooks
Height:
1.5 mm
Frequency:
400 MHz
Schedule B:
8542310000
Memory Type:
SRAM
Max Frequency:
400 MHz
Number of I/Os:
112
Number of Cores:
2
Max Supply Voltage:
3.47 V
Number of PWM Channels:
2
Number of USB Channels:
1
Number of A/D Converters:
1
Max Operating Temperature:
70 °C
Number of Timers/Counters:
8
Max Junction Temperature (Tj):
105 °C
모델 번호:
ADSP-BF606KBCZ-4
소개
ADSP-BF606KBCZ-4 Overview\\\\nADSP-BF606KBCZ-4 is a model belonging to the Embedded - DSP (Digital Signal Processors) subcategory under Integrated Circuits (ICs). For specific product performance parameters, please refer to the data sheet, such as PDF files Docx documents, etc. We have ADSP-BF606KBCZ-4 high-definition pictures and data sheets for reference. We will continue to produce various video files and 3D models for users to understand our product more intuitively and
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